The Summit 1800i is the latest in the popular Summit series. Carrying forward the leading heating capacity, throughput, repeatability, and reliability of the Summit 1800, the Summit 1800i offers a 2.2 kW Top heater boost and optimized processes for connectors, sockets, and multi-BGA rework.
HumiSeal launched synthetic rubber 1B59 LU, an enhanced version of the popular 1B51 NSLU. It has improved temperature resistance up to 150ºC and extremely low moisture vapor permeability. Its excellent flexibility enables low stress on components. The 1B59 LU is fully compliant with the RoHS Directive 2011/65/EC.
Automated Optical Inspection
With Automated Optical Inspection (AOI) becoming the inspection method of choice in the current SMT market scenario, CyberOptics’ AOI systems are designed for both post-reflow and post-placement inspection covering a comprehensive list of component and solder joint defect categories and are capable of inspecting 01005 components.
The Ultimate in Speed and Accuracy
SQ3000 3D Automated Optical Inspection (AOI) system maximizes ROI and line utilization with 3D multi-view sensors that enable fastest 3D inspection in the industry. SQ3000 incorporates Multi-Reflection Suppression technology (MRS) and highly sophisticated 3D algorithms offering microscopic image quality at production speeds. SQ3000-X offers expanded capabilities supporting large boards up to 710 x 620 mm, inspecting the most demanding assemblies without compromising measurement accuracy and repeatability.
MRS technology suppresses any reflections that can distort the data, especially on shiny components, enabling precise 3D representation while the architecturally superior sensor design captures and transmits data simultaneously and in parallel. The result is unmatched speed and accuracy.
Key Features and Benefits
- Fastest 3D inspection in the industry with architecturally faster 3D sensor
- Microscopic image quality at production speed enabled by Multi-Reflection Suppression (MRS) technology
- Inhibits reflection issues with MRS technology
- Generates high precision images of entire PCB in full color with 3D image fusing algorithms
- Large board capability with SQ3000-X
- Simpler and faster inspection with AI² technology using 2D/3D images
- Delivers precision accuracy, GR&R and lowest false call rates
- Accurate pin height/package coplanarity measurement
- Easy-to-use with simple intuitive interface and touch control
| Soldering | Solder | Tin | Lead | LeadFree |
| Glueing | Coating | Selective | Conformal | Paste |
| Thermally conductive | Silicone | Poliuretane | Acryl | Epoxy |
| Fluxing | Flux | Alcohol based | Water based | Bar |
| Wire | UV | BGA | Rework | X-ray |