Hand Soldering Materials

Kester 245 No-clean Cored Wire was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 245 No-clean Cored Wire results in visually acceptable assemblies without cleaning, yet soldering quality and efficiency is comparable to that obtained with mildly activated rosin flux. Kester 245 was formerly classified as Type LR per MIL-F-14256. Kester 245 is Bellcore GR-78 compliant.

Performance Characteristics:

• Highly reliable post-soldering residue

• Minimal residue

• Compatible with leaded and lead-free alloys

• Classified as ROL0 per J-STD-004

• Compliant to Bellcore GR-78

For Lead-bearing and Lead-free alloys

Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 275 No-Clean Flux results in an extremely clear post-soldering residue without cleaning. The unique chemistry in Kester 275 was also designed to reduce spattering common to most core fluxes. Kester 275 can be used for both lead bearing and lead-free soldering.

Performance Characteristics:

• Colorless translucent residues

• Improves wetting performance

• Excellent solderability and fast wetting to a variety of surface finishes

• Eliminates the need and expense of cleaning

• Low smoke and odor

• Low spattering

• Compatible with leaded and lead-free alloys

• Classified as ROL0 per J-STD-004

• Compliant to Bellcore GR-78

You can find any others Cored Solder wires in the Kester website: www.kester.com

For Lead-bearing and Lead-free alloys

Kester 186 Flux Pen® is specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. Kester 186 under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive. Kester 186 has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. Kester 186 possess high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.

Performance Characteristics:

• High thermal stability

• Improves soldering performance

• Eliminates the need and expense of cleaning

• Classified as ROL0 per J-STD-004

For Lead-bearing and Lead-free alloys

Kester 952-D6 is a no-clean, non-corrosive, halide free Flux Pen® that is specifically designed for

lead-free rework of conventional and surface mount circuit board assemblies. Essentially no residue remains after soldering. Kester 952-D6 was developed with a modified surface tension to

aid in soldering boards that have surface mount and high component densities. This comprehensive formulation possesses improved wetting characteristics and also exhibits superior corrosion inhibiting properties and provides a non-tacky residue. A major advantage of this flux is the reduced odor associated with the soldering process. Kester 952-D6 incorporates a small amount of rosin for higher reliablility.

Performance Characteristics:

• Residues almost colorless

• Improves soldering performance

• Reduced odor associated with soldering process

• Eliminates the need and expense of cleaning

• Non-corrosive tack-free residues

• Contains < 0.5% Rosin

• Classified as ORL0 per J-STD-004

• Compliant to Bellcore GR-78

You can find any others Flux Pens in the Kester website: www.kester.com

Kester TSF-6592LV is a No Clean Paste Flux designed as a Lead Free Solution for an array of Lead Free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any Lead Free soldering application that requires a very tacky flux. It has been optimized for consistent high speed printing applications.

Performance Characteristics:

• Compatible with Lead Free alloys such as SnAg, SnCu, SnAgCu, SnAgBi

• Reflow-able with peak temperatures up to 270 °C

• Reflow-able in air and nitrogen

• Bright shiny soldered joints with clear residues

• Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG

• Clear non-tacky residues

• High tack to minimize skewing of components

• Low voiding

• Stencil Life of 8+ hours (process dependent)

• Classified as ROL0 per J-STD-004

• Compliant to Bellcore GR-78

You can find any others Tacky Fluxes in the Kester website: www.kester.com