News archive

The Summit 1800i is the latest in the popular Summit series. Carrying forward the leading heating capacity, throughput, repeatability, and reliability of the Summit 1800, the Summit 1800i offers a 2.2 kW Top heater boost and optimized processes for connectors, sockets, and multi-BGA rework.

HumiSeal launched synthetic rubber 1B59 LU, an enhanced version of the popular 1B51 NSLU. It has improved temperature resistance up to 150ºC and extremely low moisture vapor permeability. Its excellent flexibility enables low stress on components. The 1B59 LU is fully compliant with the RoHS Directive 2011/65/EC.

Kester's award-winning Select-10 flux is now available as flux-pen. Specifically designed for the needs of the selective soldering process, it does not spread beyond the application pattern. Sustained activity within the flux allows for good barrel fill in challenging and high temperature applications. ROL0 and RoHS compliant.

DOWSIL^TM EI-2888 is the newest primerless silicone encapsulant from Dow Silicones. Featuring good primerless adhesion, inhibition resistance and superb optical clarity, this innovative product is particularly suitable for encapsulating rigid and flexible circuit boards for LED Lighting, explosion proof and high ingress protection rated luminaire.

PACE launches Arm-Evac 150, a new low-cost fume extraction system for benchtop soldering and rework applications. The central filtration unit is a quiet, low profile, compact system which fits under any workbench. Comes complete with a general purpose combo filter, SteadyFlex^TM ESD-safe arm & nozzle assembly and wireless remote control.

SMTCAD is a new dedicated stencil design package that integrates seamlessly with Blueprint and perfectly partners with the latest Tannlin stencil laser system. SMTCAD delivers the features needed for complete control of your paste creation, modification and design quality control. The system provides automatic footprint detection and conversion at component level.

Kester launches WP616, a zero-halogen, Pb-free, water soluble solder paste paste formula for both nitrogen and air reflow applications. WP616 has consistent print performance at wide humidity levels, excellent solderability and ease of cleaning.

The SQ3000-DD is the dual lane, dual sensor extension of the award-winning SQ3000™ 3D AOI platform. The dual lane provides the ability to inspect different assemblies simultaneously, or by switching to single lane mode to inspect very large boards. The images transmitted in parallel by the two MRS sensors are fused together by highly sophisticated algorithms, delivering microscopic image quality at production speed.

Kester launches NP560, a no-clean, Pb-free, halogen-free solder paste. It has a paste transfer efficiency of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping. In addition it can achieve ultra-low (<5%) voiding across different QFN sizes.

Dow Performance Silicones introduced DOWSIL™ EA-6060, a two-part high-performance adhesive designed for the automotive industry. It develops required adhesion within 30 minutes at 80°C, and it also allows accelerated cure at higher temperatures. After cure, it delivers reliable adhesion for common metal and plastic substrates, while remaining free of bubbles and voids.

Kester's SELECT-10^TM selective solder flux won Global SMT’s Global Technology Award. The award was presented during the Productronica exhibition in Munich. SELECT-10™ Selective Solder Flux is a zero-halogen no-clean liquid flux designed specifically for the needs of the selective soldering process.

CyberOptics was awarded a 2017 Global Technology Award for its Ultra-High Resolution Multi-Reflection Suppression (MRS) sensor for the award-winning SQ3000™ 3D AOI system. With even finer resolution, this sensor enhances the SQ3000 3D AOI platform, delivering superior inspection performance, ideally suited for the 0201 metric process and micro-electronic applications.

Aquanox^® A4625B is an innovative aqueous circuit board clean chemistry specifically designed to remove all types of electronic flux residues, including the latest lead-frees, in batch washers. It is optimized for batch and inline spray-in-air cleaning machines.

Dow Corning introduced EA-5151, the first product of the new Quick in Connect silicone adhesive family. It features very fast green strength at room temperature, bonding without the need for primers to a broad range of metals and plastics, possibility to be easily removed and reapplied, and durable adhesion after curing.

HumiSeal Introduces the UV92, a one part, thixotropic, UV curable masking gel for temporary protection of components during the coating process. UV92 is user-friendly during application, curing, and removal process. This product comes in various cartridge sizes and bulk packaging.

The revolutionary XQuik II with AccuCount Technology is now faster than ever. With available material handling automation, the XQuik system automatically counts components at up to twice the original speed. Parallel processing allows the system to aquire images and calculate component count in parallel with bar code scan, loading and labeling of reels.

Building on their range of high performance stencils for the electronics assembly industry, comes the new Tannlin Multilevel stencil. Manufactured using the Tannlin proprietary laser process allows greater flexibility and control in the print process over standard SMT stencils. 

The VJ Electronix XQuik II with AccuCount is designed to reduce time and manpower required for incoming inspection and cycle counting of electronic components. There is no programming or set up required. The system’s proprietary technology automatically detects component size and reports the total component count.

The company continues to invest in technology, and as a result, they introduced two new series of UV materials – UV50 and UV500. These new products mark a significant milestone in the ability of coatings to meet the increasing demands placed on more challenging performance standards.

VJ Electronix presents the new Summit II rework platform. Summit II combines the latest in controls and ergonomics from the Micra with the throughput, accuracy and reliability of the renowned Summit 1800.

The Tannlin T11, the latest, highly integrated laser stencil cutting machine incorporates simultaneous automatic optical inspection, to guarantee perfect laser cut apertures for the highest performance stencils in electronics assembly processing.

Stencil ordering is made easy with Blueprint allowing a joint focus on every part of the process from order entry through design modifications to manufacture and shipment.